Technical Intern, Package Design Engineer
Description
Invent the future with us.
Recognized by Fast Company’s 2023 100 Best Workplaces for Innovators List, Ampere is a semiconductor design company for a new era, leading the future of computing with an innovative approach to CPU design focused on high-performance, energy efficient, sustainable cloud computing.
By providing a new level of predictable performance, efficiency, and sustainability Ampere is working with leading cloud suppliers and a growing partner ecosystem to deliver cloud instances, servers and embedded/edge products that can handle the compute demands of today and tomorrow.
Join us at Ampere and work alongside a passionate and growing team — we’d love to have you apply!
About the role:
- You will be a part of the Package and Systems Engineering Team, which is responsible for the design and development of a variety of high-performance semiconductor IC (Integrated Circuit) packaging solutions for the latest ARM-64bit Server Technology Chip production. You will work with Package and PCB layout teams, Signal and Power Integrity teams to verify signal characteristics and optimize signal routing and power delivery networks. You will set your own limits for learning and achievements.
- You will have an opportunity to work collaboratively with and learn from veteran industrial designers and architects and to contribute to breakthrough designs for cloud computing. Our engineers are excited about technology and innovation, and channel that energy to deliver world-class products.
- Technical Intern, Package Design Engineer needs to have solid knowledge of electric circuits/electronics/micro-electronics and electromagnetic field theory, particularly as it relates to high-speed signal propagation and power delivery. Understanding common electrical interfaces such as I2C, SPI, UART, as well as common electrical circuits, such as Operational Amplifiers, LDOs, Bulk, Boost switching voltage regulators is an advantage. In addition, knowledge in the fields of Signal Processing and Digital Communications would be useful for troubleshooting and understanding the behavior seen in simulation results.
What you’ll achieve:
- Post-layout simulation for power integrity and signal integrity.
- Work with layout routing adjustments and passive component selection.
- Collaborate with Silicon Engineering/ Hardware Platform Engineering to achieve optimal performance for silicon, IC packages, and platforms.
About you:
- Experience with some hardware projects (Circuit/PCB design and simulation) at your school is preferred.
- Experience and/or knowledge in microprocessor and communication system development.
- Experience and/or knowledge in power regulator design, simulations, and measurements; characterizing the power rail is a plus.
- Knowledge and experience with Allegro PCB Design/Simulation tools are preferred.
- Good communication skills in English and Vietnamese
Education:
- Candidate must be pursuing a Bachelor’s Degree in Electrical & Electronic Engineering/ Computer Engineering as the 4th year Students with strong academic record or equivalent.
What we’ll offer:
At Ampere we believe in taking care of our interns and providing a competitive monthly stipend and allowance.
Benefits highlights include:
- Mentorship and on-the-job training from industry experts
- Daily catered lunch, a variety of snacks, energizing coffee or tea, and refreshing drinks to keep you fueled and focused throughout the day.
- Intern events, cultural and engagement activities with the team and the company
At Ampere, we foster an inclusive culture that empowers our interns to do more and grow more. We are excited to share more about our internship opportunities with you through the interview process.